Modular ESP32‑S3 Framework

A fully modular, 3D‑printable enclosure and electronics ecosystem built around the ESP32‑S3. Inspired by Gridfinity-style reusability, designed for rapid prototyping and long‑term projects.

Project Overview

Concept

This project focuses purely on extendibility and customizability to fit your next ESP32 project. Download or design your own modules, then simply stack them together and build your own super-case.

Modular FDM printing

Community

The framework is fully communitiy driven. Users can design and share their own extension modules building an even more powerful ESP32 project. Find the schematics for extension modules on GitHub

Extension system Schematics

Expansion Modules

Functional modules can be stacked or swapped without redesigning the base enclosure. Sensors, displays, relays, and custom electronics can all share the same ecosystem.

All mechanical designs and schematics are released as open source to encourage community remixes.

Depending on your stack, 3D print module type A or B.

Getting Started

Base Kit

The core of the framework is a compact ESP32‑S3 DevKit enclosure providing power, connectivity, and standardized expansion interfaces.

Print directly from Makerworld.

Project FDM printing

Discover Modules

Head over to makerworld and find other people's extension modules. Feel free to participate and share your own design.

Open the Modular-ESP32 collection on Makerworld.

Collection FDM printing

Featured Modules

Description

The SAQM module extends the base system with professional‑grade air quality sensing using the Sensirion SEN55 sensor. Designed for accurate airflow, low noise, and easy integration.

Print directly from Makerworld.

Esphome Sensirion SEN55

Description

This module extends the base system with one of the best I/O systems ever made: LAN. Either connect sensors to a LAN port directly or connect the ESP32 to your network.

Print directly from Makerworld.

Esphome LAN I/O

Technical Details

Electronics & Software

  • ESP32‑S3 DevKit
  • USB‑C power
  • Modular internal wiring

3D Printing

  • Material: PLA / PETG
  • Layer height: 0.2 mm recommended
  • No supports required
  • Optimized for FDM printers

Bill of Materials

  • Listed in every Makerworld project
  • All screws used are M3 standards
  • Most materials are easily accesible